Product numbering identification guide for vintage Intel chips
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this Intel chip would be an 8096 micro-controller in PLCC packaging w/ commercial temp, with burn-in.
Intel special processing Codes
M - Military Spec 883 B
J - JAN qualified Product (Joint Army Navy: Mil Spec level MIL-S-19500)
L - Extended Temp. -40 to +86 with Burn-In *
Q - Commercial Temp. 0 to +70 with Burn-In *
T - Extended Temp. -40 to +85 without Burn-In *
(* burn-in = 186 Hours of dynamic Burn-in, all temps are in Celsius)
Intel package type Codes
A - Ceramic PGA
C - Ceramic DIP
D - CERDIP
L - Plastic PGA
P - Plastic DIP
R - Ceramic LCC
N - PLCC
(PGA = Pin Grid Array, LCC = Leadless Carrier Chip, DIP = Dual In-line Package)
this Intel chip would be an 8096 micro-controller in PLCC packaging w/ commercial temp, with burn-in.
Intel special processing Codes
M - Military Spec 883 B
J - JAN qualified Product (Joint Army Navy: Mil Spec level MIL-S-19500)
L - Extended Temp. -40 to +86 with Burn-In *
Q - Commercial Temp. 0 to +70 with Burn-In *
T - Extended Temp. -40 to +85 without Burn-In *
(* burn-in = 186 Hours of dynamic Burn-in, all temps are in Celsius)
Intel package type Codes
A - Ceramic PGA
C - Ceramic DIP
D - CERDIP
L - Plastic PGA
P - Plastic DIP
R - Ceramic LCC
N - PLCC
(PGA = Pin Grid Array, LCC = Leadless Carrier Chip, DIP = Dual In-line Package)
An Intel P4004 CPU. The "P" product code is for plastic DIP packaging (1976)
Intel Chip Package Types (1985)
Related: The collectors guide to Vintage Intel Microchips - CPU Values and Identification
Identifying Integrated Circuit Package Types: manufacturers logos & Date codes
AMD Amdahl Analog Devices Apple Atari AT&T Bell Labs Burroughs
Control Data Cray Cyrix Data General DEC ESI Fujitsu HP Hughes
IBM Intel ITT LSI Memorex Micron MIT Microvision Motorola National Semi
NCR NEC Nvidia Panasonic PHILCO PMI RCA Remington Rand Samsung
Signetics Sperry Sun Microsystems TSMC UNIVAC Western Electric Etc.