How Lucite Paperweights with Embedments are made

Western Electric Lucite Paperweight with many Embedments
Embedding objects in plastic resin involves making a casting of two or more layers with the objects sandwiched between the layers. Generally, you work in reverse when embedding objects. (It is like making an upside down cake.)
The first layer you pour becomes the top or face of your casting. Pour the first layer of catalyzed resin into mold and allow the resin to gel until firm enough to support the embedments, approx. (20-30 minutes) or use Gel Promoter to gel the resin in as little as 90 seconds.
Prepare the next batch of resin and stir. To avoid trapping air, dip embedment's into the catalyzed resin; set in place face down on the first gelled layer. Pour balance of catalyzed resin over the embedments.
If the embedments are not yet covered or if you want a colored background, pour a third clear or colored layer after the second layer has gelled. Embedments can be placed in several levels to create a "floating" appearance.
After final layer has been poured, allow casting to harden completely before removing from the mold.
The first layer you pour becomes the top or face of your casting. Pour the first layer of catalyzed resin into mold and allow the resin to gel until firm enough to support the embedments, approx. (20-30 minutes) or use Gel Promoter to gel the resin in as little as 90 seconds.
Prepare the next batch of resin and stir. To avoid trapping air, dip embedment's into the catalyzed resin; set in place face down on the first gelled layer. Pour balance of catalyzed resin over the embedments.
If the embedments are not yet covered or if you want a colored background, pour a third clear or colored layer after the second layer has gelled. Embedments can be placed in several levels to create a "floating" appearance.
After final layer has been poured, allow casting to harden completely before removing from the mold.
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AMD Amdahl Analog Devices Apple Atari AT&T Bell Labs Burroughs
Control Data Cray Cyrix Data General DEC ESI Fujitsu HP Hughes
IBM Intel ITT LSI Memorex Micron MIT Microvision Motorola National Semi
NCR NEC Nvidia Panasonic PHILCO PMI RCA Remington Rand Samsung
Signetics Sperry Sun Microsystems TSMC UNIVAC Western Electric Etc.
