 IBM Memorabilia |
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IBM SLT (Solid Logic Technology) Chip (1964)
Item #171
An IBM 12-pin IBM SLT solid logic chip & it's cover, encased in blue lucite.
IBM SLD (Solid Logic Dense) Chip (1965)
Item #168
IBM's SLT and SLD were hybrid technologies in which transistors and other components were placed on a ceramic substrate. MST was the first IBM monolithic integrated circuit technology (multiple circuits on one silicon chip and arranged on a ceramic substrate). SLT and SLD circuits were used in System 360 and other equipment of the same time during the mid 1960's.
IBM MST (Monolithic Systems Technology) Chip (1968)
Item #169
IBM's MST (Monolithic Systems Technology) chips were used in later System 360s such as the Model 85, and all System 370's during the late 1960's and 70's. Some MST modules used multiple integrated circuits on one ceramic substrate.
IBM MST Chip (1968)
Item #170
Another type of IBM MST chip with cover encased in blue Lucite.
IBM East Fishkill NY., Chip Fab Silicon Ribbon Paperweight (late 1970s)
Item #261
This Paperweight has a sample of a silicon ribbon used in IBM's chip manufacturing facility in East Fishkill, NJ.
In 1993 IBM announced that they would be phasing out mass manufacturing of computer chips at it's East Fishkill, New York plant, and would instead use the plant exclusively for making packaging components that hold the chips.
More information on Silicon Wafers.
In 1993 IBM announced that they would be phasing out mass manufacturing of computer chips at it's East Fishkill, New York plant, and would instead use the plant exclusively for making packaging components that hold the chips.
More information on Silicon Wafers.
IBM 4300 General Systems Division 32k & 64k Bit Memory Chips (1979)
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In 1979, IBM introduced the IBM 4300 series computer system with Large Scale Integration (LSI) logic and solid-state memory based on it's new advanced 64k bit chip.
IBM paperweight has the 32k & 64k Bits memory chips embedded inside clear Lucite with a red background. Reads "IBM General Systems Division".
IBM paperweight has the 32k & 64k Bits memory chips embedded inside clear Lucite with a red background. Reads "IBM General Systems Division".
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 IBM Silicon Computer Chip Ad (1980) |
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IBM Advanced Technology Paperweight (1979) Item #479
IBM Chip Technology paperweight, has four different types of chips embedded in clear Lucite with a blue background.
Actual IBM Chips embedded include: SAMOS 72K and SAMOS 64K RAM chips, the 704 circuit bipolar logic chip, and MOSFET microprocessor logic chip. Paperweight reads "Advanced Technology...In Advanced Products" on front. Measures 4" X 2.5" X 1".       |
IBM Advanced Technology SAMOS Paperweight (1979)
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Clear Lucite IBM Advanced Technology Paperweight featuring IBM SAMOS (silicon and aluminum metal oxide semiconductor) integrated circuit technology from the late 1970's.
Paperweight has four different types of chips embedded inside. Actual IBM Chips embedded include: SAMOS 72K and SAMOS 64K RAM chips, the 704 circuit bipolar logic chip, and MOSFET microprocessor logic chip.
Paperweight reads "Advanced Technology...In Advanced Products" on front.
Measures 4" X 2.5" X 1"
Paperweight has four different types of chips embedded inside. Actual IBM Chips embedded include: SAMOS 72K and SAMOS 64K RAM chips, the 704 circuit bipolar logic chip, and MOSFET microprocessor logic chip.
Paperweight reads "Advanced Technology...In Advanced Products" on front.
Measures 4" X 2.5" X 1"
IBM Advanced Technology SAMOS Paperweight (1979)
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IBM Chip Technology paperweight, has four different types of chips embedded in clear Lucite with red background.
Actual IBM Chips embedded include: SAMOS 72K and SAMOS 64K RAM chips, the 704 circuit bipolar logic chip, and MOSFET microprocessor logic chip.
Paperweight reads "Advanced Technology...In Advanced Products" on front.
Measures 4" X 2.5" X 1".
Actual IBM Chips embedded include: SAMOS 72K and SAMOS 64K RAM chips, the 704 circuit bipolar logic chip, and MOSFET microprocessor logic chip.
Paperweight reads "Advanced Technology...In Advanced Products" on front.
Measures 4" X 2.5" X 1".
IBM Advanced Technology Paperweight (1979)
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IBM Technology Marketing Support Center paperweight, has four different types of chips embedded in clear Lucite with a blue background.
Actual IBM Chips embedded include: SAMOS 72K and SAMOS 64K RAM chips, the 704 circuit bipolar logic chip, and MOSFET microprocessor logic chip.
Paperweight reads "Advanced Technology...In Advanced Products" on front.
Measures 4" X 2.5" X 1"
Actual IBM Chips embedded include: SAMOS 72K and SAMOS 64K RAM chips, the 704 circuit bipolar logic chip, and MOSFET microprocessor logic chip.
Paperweight reads "Advanced Technology...In Advanced Products" on front.
Measures 4" X 2.5" X 1"
IBM 3370 DASD Film Head Advanced Technology (1979)
Item #494
The IBM 3370 Direct Access Storage Device that was released in 1979 introduced thin-film head technology to large disk
files. The IBM 3370 was an advanced 571.3MB fixed-media
disk storage for use with the IBM 4331 and 4341 processors and the IBM System/38 midrange
computer.
Work on thin-film disk drive head technology was started in IBM’s Thomas J. Watson Research Center in Yorktown Heights, N.Y. in the late-1960s.
IBM clear Lucite paperweight with blue background has embedded chips & head assembly for the DASD (direct access storage device) Thin-film Head Technology.
Measures 4" x 2 1/2 " x 1".
Work on thin-film disk drive head technology was started in IBM’s Thomas J. Watson Research Center in Yorktown Heights, N.Y. in the late-1960s.
IBM clear Lucite paperweight with blue background has embedded chips & head assembly for the DASD (direct access storage device) Thin-film Head Technology.
Measures 4" x 2 1/2 " x 1".
IBM Advanced Technology Paperweight (1979)
Item #426
IBM Technology Marketing Support Center paperweight, has four different types of chips embedded in Lucite.
Actual IBM Chips embedded include: SAMOS 72K and SAMOS 64K RAM chips, the 704 circuit bipolar logic chip, and MOSFET microprocessor logic chip.
Paperweight reads "Advanced Technology...In Advanced Products" on front.
Measures 4" X 2.5" X 1".
Actual IBM Chips embedded include: SAMOS 72K and SAMOS 64K RAM chips, the 704 circuit bipolar logic chip, and MOSFET microprocessor logic chip.
Paperweight reads "Advanced Technology...In Advanced Products" on front.
Measures 4" X 2.5" X 1".
IBM Computer Chip Keychain (Late 1970s)
Item #434
An unknown IBM computer chip encased in Lucite with IBM logo.
IBM / Intel 386 Button (1986)
Item #452
The Intel 386 was a 32-bit Microprocessor introduced by Intel in 1985. The first versions had 275,000 transistors.
The 386 was for a time only available from Intel, since Andy Grove, Intel's CEO at the time, made the decision not to encourage other manufacturers to produce the processor as second sources. This decision was ultimately crucial to Intel's success in the market.The 386 was the first significant microprocessor to be single-sourced. Single-sourcing the 386 allowed Intel greater control over its development and substantially greater profits in later years. Production of the 386 lasted until it's end in 2007.
The 386 was for a time only available from Intel, since Andy Grove, Intel's CEO at the time, made the decision not to encourage other manufacturers to produce the processor as second sources. This decision was ultimately crucial to Intel's success in the market.The 386 was the first significant microprocessor to be single-sourced. Single-sourcing the 386 allowed Intel greater control over its development and substantially greater profits in later years. Production of the 386 lasted until it's end in 2007.
IBM PowerPC RISC System/6000 Computer Chips (1990)
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RISC System/6000, or RS/6000 for short, is a family of RISC and Unix based servers, workstations and supercomputers made by IBM in the 1990s.
The RS/6000 family replaced the IBM RT computer platform in February 1990 and was the first computer line to see the use of IBM's POWER and PowerPC based microprocessors.
The Apple Macintosh would make use of the PowerPC microprocessor in 1992. RS/6000 was renamed eServer pSeries in October 2000.
This Lucite Paperweight has nine computer chips embedded inside including IBM memory chips and processor chips. Top of paperweight is clear and the background is orange.
Measures 4" x 4".
The RS/6000 family replaced the IBM RT computer platform in February 1990 and was the first computer line to see the use of IBM's POWER and PowerPC based microprocessors.
The Apple Macintosh would make use of the PowerPC microprocessor in 1992. RS/6000 was renamed eServer pSeries in October 2000.
This Lucite Paperweight has nine computer chips embedded inside including IBM memory chips and processor chips. Top of paperweight is clear and the background is orange.
Measures 4" x 4".
IBM / Motorola PowerPC 601 CPU First Silicon (1992)
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In October 1991 at the Microprocessor Forum in San Francisco, IBM and Motorola outline a four year road map of PowerPC processors, starting with a low-cost desktop processor, and culminating in a high performance processor for servers and workstations. A month later IBM announced the PowerPC 601 microprocessor. Exactly one year later At the 1992 Microprocessor Forum, IBM and Motorola formally announce the beginning of production of PowerPC 601 microprocessors, in 50 MHz and 66 MHz versions.
PowerPC stands for "Power Performance Chip", and incorporates an integer unit, a floating-point unit, and 32 MB cache. IBM produces the processor using 0.6-micron CMOS technology, with 2.8 million transistors per chip.
PowerPC stands for "Power Performance Chip", and incorporates an integer unit, a floating-point unit, and 32 MB cache. IBM produces the processor using 0.6-micron CMOS technology, with 2.8 million transistors per chip.
IBM PowerPC Timeline
Apple / IBM PowerPC 601 CPU Chip Button (1993)
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The IBM PowerPC 601 chip was the first version of a RISC processor developed jointly between IBM Microelectronics and Motorola.
The PowerPC 601 was the first generation of microprocessors to support the basic 32-bit PowerPC instruction set. The 601 processor ran at speeds of 55-80Mhz. IBM was the sole manufacturer of the 601 and microprocessors in its Burlington, Vermont & East Fishkill, New York production facilities. The 601 was manufactured using IBM's CMOS-4s process.
First launched in IBM systems in the fall of 1993, it was marketed by IBM as the PPC601 and by Motorola as the MPC601. It operated at speeds ranging from 50 to 80 MHz. It was fabricated using a 0.6 µm CMOS process with four levels of aluminum interconnect. The die was 121 mm² large and contained 2.8 million transistors.
The 601 has a 32 kB unified L1 cache, a capacity that was considered large at the time for an on-chip cache. Thanks partly to the large cache it was considered a high performance processor in its segment, outperforming the competing Intel Pentium. The PowerPC 601 was used in the first Power Macintosh computers from Apple, and in a variety of RS/6000 workstations and SMP servers from IBM and Groupe Bull.
Stick-on promotional button has a real power PC chip encased inside enamel for viewing.
The PowerPC 601 was the first generation of microprocessors to support the basic 32-bit PowerPC instruction set. The 601 processor ran at speeds of 55-80Mhz. IBM was the sole manufacturer of the 601 and microprocessors in its Burlington, Vermont & East Fishkill, New York production facilities. The 601 was manufactured using IBM's CMOS-4s process.
First launched in IBM systems in the fall of 1993, it was marketed by IBM as the PPC601 and by Motorola as the MPC601. It operated at speeds ranging from 50 to 80 MHz. It was fabricated using a 0.6 µm CMOS process with four levels of aluminum interconnect. The die was 121 mm² large and contained 2.8 million transistors.
The 601 has a 32 kB unified L1 cache, a capacity that was considered large at the time for an on-chip cache. Thanks partly to the large cache it was considered a high performance processor in its segment, outperforming the competing Intel Pentium. The PowerPC 601 was used in the first Power Macintosh computers from Apple, and in a variety of RS/6000 workstations and SMP servers from IBM and Groupe Bull.
Stick-on promotional button has a real power PC chip encased inside enamel for viewing.
IBM Fab 323 B323 East Fishkill Chip Keychain (2005)
Item #601
IBM's Fab Building 323 (B323) was IBM's first 300mm semiconductor Fab. Located in East. Fishkill, NY. it was opened in 2003 with a $2.5 billion price tag.
This keychain features an IBM CMOS chip embedded in Lucite. It was given to IBM employees at Fab 323 to celebrate the Fab winning the 2005 Semiconductor International Top Fab Award.
OAK BROOK, Ill., Dec. 1 /PRNewswire/ -- Semiconductor International has announced its 2005 Top Fab of the Year Award winner as IBM Building 323, East Fishkill, N.Y. The 2005 winner is featured in the December issue of the magazine. "IBM's Fab 323 exemplifies the state-of-the-art in global semiconductor manufacturing," noted Peter Singer, Editor-in-Chief of Semiconductor International. "It is a fully automated 300 mm fab where a diverse set of complex products are produced with the latest process technologies, such as strained silicon. We were particularly impressed with the fab's 'first-time right' track record."
This keychain features an IBM CMOS chip embedded in Lucite. It was given to IBM employees at Fab 323 to celebrate the Fab winning the 2005 Semiconductor International Top Fab Award.
OAK BROOK, Ill., Dec. 1 /PRNewswire/ -- Semiconductor International has announced its 2005 Top Fab of the Year Award winner as IBM Building 323, East Fishkill, N.Y. The 2005 winner is featured in the December issue of the magazine. "IBM's Fab 323 exemplifies the state-of-the-art in global semiconductor manufacturing," noted Peter Singer, Editor-in-Chief of Semiconductor International. "It is a fully automated 300 mm fab where a diverse set of complex products are produced with the latest process technologies, such as strained silicon. We were particularly impressed with the fab's 'first-time right' track record."
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 'IBM: 300mm Fab, East Fishkill' |
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